Flip-chip integrated superconducting qubits using electroplated bump bonds
📄 arXiv:2608.07306 · 📥 PDF · 2026-08-07 · quant-ph
Authors: Yen-An Shih [arXiv · scholar] , Rebecca Gharibaan [arXiv · scholar] , Barka Khan [arXiv · scholar] , Dhananjay Joshi [arXiv · scholar] , Siddharth Singh [arXiv · scholar] , Martijn F. S. Zwanenburg [arXiv · scholar] , Eugene Y. Huang [arXiv · scholar] , Nataliia Zhurbina [arXiv · scholar] , Figen Yilmaz [arXiv · scholar] , Lukas Johannes Splitthoff [arXiv · scholar] , Srijit Goswami [arXiv · scholar] , Christian Kraglund Andersen [arXiv · scholar]
📄 Abstract
Flip-chip integration offers a promising route toward scalable superconducting quantum processors and hybrid semiconductor-superconductor quantum devices. We develop a three-dimensional transmon architecture using electroplated indium in which the qubit electric field is shared nearly equally between two bump-bonded substrates while maintaining low participation at the indium-bump interface. The resulting geometry is well suited for future hybrid qubits, enabling the integration of distinct material platforms while minimizing sensitivity to bump-interface loss. Using this platform, we evaluate electroplated indium interconnects for superconducting quantum circuits. Flip-chip transmons incorporating electroplated indium bumps exhibit qubit quality factors around $10^6$. In addition, a systematic study of coplanar-waveguide resonators is used to identify losses associated with the electroplating process. In particular, we find that surface losses associated with the gold-layer, used to enable good electric contact with the indium, is likely the primary contributor to the qubit decay rate. These results demonstrate the compatibility of electroplated indium technology with high-coherence superconducting circuits and establish a promising platform for three-dimensional hybrid quantum integration.